• Document: Ceramic Ball Grid Array Packaging, Assembly & Reliability. Freescale Semiconductor
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Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • Why BGA???? • CBGA Introduction and Package Description • PC Board Design for CBGA • CBGA Assembly • Rework • Board-Level Solder Joint Reliability Freescale Semiconductor 2 Why BGA????? • Advantages: – Higher Surface Mount Assembly Yield. » Coarse Pitches Compared to Fine Pitch Leaded. » Self-Centering. » Not Easily Susceptible to Handling Damage. – High I/O Density and High Pin Count Capability. – “Drop-In” Multi-Chip Capability. – Potentially Better Electrical and Thermal Performance Than Leaded Packages. – Compatibility with Most or All Existing Surface Mount Equipment. • Limitations: – More Difficult to Inspect (But You Do Not Need To). – Any Defect Requires Removal and Replacement of Entire Package (No Touch-Up). Freescale Semiconductor 3 BGA Assembly Yields (As Reported by IBM and Compaq) 200 IBM Data on CBGA COMPAQ Data 150 .5 mm Pitch QFP on PBGA (Collapsing Ball) DPPMj* .65 mm Pitch QFP 100 1.27 mm Pitch CBGA 85 85 80 60 50 48 20 30 15 15 12 < 0.5 (COMPAQ ) <5 5 1 2 1991 1992 1993 1994 Year * DPPMj = Defective Joints Per Million Assembled Freescale Semiconductor 4 CBGA Construction 97Pb/3Sn C4* Joint Silicon Die Alumina (Al2O3) Ceramic Epoxy Substrate Underfill 0.89 mm Solder Ball 1.27 mm Pitch for 1.27 mm Pitch 10Sn/90Pb 63Sn/37Pb Solder Solder Balls Ball to Substrate Attach C4 = Controlled Collapse Chip Connection (Evaporated 97Pb/3Sn Bump) Freescale Semiconductor 5 CBGA Construction (Cont.) • 304 Pin C4*/CBGA (Motorola MPC106 PCI Bridge Chip) Underfill 21 mm Silicon Die Ceramic Substrate 25 mm * C4 = IBM Developed Controlled Collapse Chip Conne Freescale Semiconductor 6 CBGA Construction (Cont.) •SEM Micrograph of Board-Mounted CBGA Substrate (No Chip) Showing Substrate Circuitry. Freescale Semiconductor 7 CBGA Solder Balls 0.89 mm Diameter 90% Pb and 10% Sn (by Weight) “High CBGA Substrate Melt” Solder Ball Held to CBGA Substrate and Motherboard with Eutectic (63Sn/37Pb) Solder. Typically 0.89 to 0.94 mm Eutectic Solder Applied to the Motherboard Before Reflow. Must Have Minimum Eutectic Solder Motherboard Paste Volume of 4,800 mils3. Freescale Semiconductor 8 Motorola Products in CBGA Body Pin Pitch Array Comments/Products Size Count 14 x 22 119 and 1.27 7 x 17 Fast SRAMs 153 9 x 17 21 255 1.27 16 x 16 60X P

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